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US 12,733,450 B2Granted
Multi-material chuck
AssigneeTokyo Electron Limited
InventorsChristopher Netzband, Adam Gildea
Life of this patent
Estimating the term…
Abstract
Conformal semiconductor chucks are disclosed. The semiconductor chucks can include a first portion comprising a first vacuum pad. The semiconductor chucks can include a second portion exhibiting greater compliance than either of the first portion or a third portion. The semiconductor chucks can include the third portion comprising a second vacuum pad.
Claims20
A system for fabricating semiconductor devices, comprising:
- a first portion of a semiconductor chuck comprising a first material along a facing thereof;
- a second portion of the semiconductor chuck circumscribed about the first portion along the facing, the second portion configured to exhibit greater compliance than the first material, wherein a second material of the second portion extends, from the facing, into the semiconductor chuck;
- a third portion of the semiconductor chuck circumscribed about the first portion along the facing, the third portion configured to exhibit greater compliance than the first material;
- and
- a plurality of wafer holders disposed along the facing, the wafer holders configured to selectively couple a to a semiconductor wafer along the facing.
2 more elements
A method, comprising:
- actuating a plurality of wafer holders to couple a first wafer to a wafer chuck;
- and
- instantiating, at an instantiation point, wafer bonding between the first wafer and a second wafer, wherein the first wafer is coupled to a plurality of portions of the wafer chuck, the plurality of portions comprising:
- a first portion comprising a first material;
- a second portion circumscribing first portion, the second portion configured to exhibit greater compliance than the first portion, wherein a second material of the second portion extends, from a facing of the wafer chuck, into the wafer chuck;
- and
- a third portion circumscribing the first portion, the third portion comprising the plurality of wafer holders.
4 more elements
A wafer chuck comprising:
- a first portion comprising a first vacuum pad;
- a second portion which does not comprise a vacuum pad, the second portion exhibiting greater compliance than either of the first portion or a third portion, wherein the second portion extends, from a facing including the first vacuum pad, into the wafer chuck;
- and
- the third portion comprising a second vacuum pad.
1 more element
Dependencies are inferred from the claim text.