Preparation method for semiconductor material leg array and batch preparation method for interface layer of semiconductor material leg array

A preparation method for a semiconductor material leg array, comprising:

• placing a semiconductor block material on a surface of an extrusion mold;
• placing the semiconductor block material and the extrusion mold in a pressure-resistant sleeve;
• subjecting the semiconductor block material to plastic deformation by extrusion and filling holes that are arranged in an array on the surface of the extrusion mold;
• and
• demolding to obtain a semiconductor material leg array;
• wherein the temperature of extrusion is 5° C. to 500° C., and is equal to or higher than the softening temperature of the semiconductor block material;
• the pressure of extrusion is 1 MPa to 10 GPa;
• and the pressure-holding time of extrusion is 1 to 100 minutes;
• wherein the temperature of demolding is 10° C. to 170° C. and higher than the softening temperature of the semiconductor block material.