Process for fabricating an optoelectronic device comprising a step of producing a thin conductive layer conformally and continuously by directional deposition
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsLudovic Dupre, Hélène Fournier
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Abstract
A method for manufacturing an optoelectronic device comprising a substrate and wire diodes having an h:d spacing aspect ratio that is at least equal to 1, the method comprising a step of producing a conductive thin film by directional physical vapour deposition, the substrate experiences a periodic rotational movement and a periodic oscillation movement so that the conductive thin film is deposited on the substrate and the sides of the wire diodes in a conformal and continuous manner.
Claims12
Method A manufacturing method for manufacturing an optoelectronic device comprising:
- a substrate, and a plurality of wire diodes for emitting or detecting light resting on the substrate, each having an average height h and being spaced apart with an average relative spacing d from side to side, such that an h:d spacing aspect ratio is at least equal to 1, the method comprising:
- producing a lower conductive thin film, made of at least one electrically conductive material, to form a lower electrode by performing directional physical vapour deposition in a main deposition direction oriented towards the substrate and the wire diodes, resulting in an incident material flow of the electrically conductive material,
- wherein the substrate rests on a support of a substrate holder, the support experiencing a periodic rotational movement so that sides of the wire diodes are exposed to the incident material flow at a rotation frequency, and a periodic oscillation movement of an angle of inclination formed between a main axis orthogonal to the substrate and a fixed axis parallel to the main deposition direction ranging at most up to a threshold value equal to arctan and including the value 0°, at an angular oscillation frequency;
- and
- the frequencies of rotation and of angular oscillation being predefined so that the lower conductive thin film is deposited on the substrate and the sides of the wire diodes in a conformal and continuous manner.
Dependencies are inferred from the claim text.