Photoelectric conversion apparatus, photoelectric conversion system, and mobile body
AssigneeCanon Kabushiki Kaisha
InventorsJunji Iwata, Kazuhiro Morimoto, Yu Maehashi, Yoshiyuki Hayashi
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Abstract
An apparatus includes a first substrate having a plurality of avalanche diodes, a second substrate having a plurality of pixel circuits, and a third substrate having a signal processing circuit. The second substrate and the third substrate are stacked in such a manner that a third wiring structure is provided between two semiconductor layers of the second substrate and the third substrate. The apparatus includes first through-hole wiring going through the semiconductor layer of the third substrate.
Claims16
A photoelectric conversion apparatus, comprising:
- a first substrate that includes a first semiconductor layer and a first wiring structure, the first semiconductor layer including a plurality of photoelectric conversion units;
- a second substrate that includes a second semiconductor layer and a second wiring structure, the second semiconductor layer including a plurality of pixel circuits provided in such a way as to correspond to the plurality of photoelectric conversion units;
- a third substrate that includes a third semiconductor layer and a third wiring structure, the third semiconductor layer including a signal processing circuit configured to process signals outputted from the plurality of pixel circuits;
- first through-hole wiring going through the third semiconductor layer,
- wherein each of the plurality of photoelectric conversion units includes an avalanche diode,
- wherein the first substrate and the second substrate are stacked such that the first wiring structure and the second wiring structure are provided between the first semiconductor layer and the second semiconductor layer, and
- wherein the second substrate and the third substrate are stacked such that the third wiring structure is provided between the second semiconductor layer and the third semiconductor layer;
- and
- a pixel area where a plurality of pixels including the plurality of photoelectric conversion units is provided, wherein
- the first wiring structure includes a plurality of first junction portions,
- the second wiring structure includes a plurality of second junction portions,
- the plurality of first junction portions is joined to the plurality of second junction portions, respectively, thereby forming a plurality of metal junctions, and
- in a plan view, each of the plurality of metal junctions arranged in the pixel area is provided for corresponding one of the plurality of photoelectric conversion units.
A photoelectric conversion apparatus comprising:
- a first substrate that includes a first semiconductor layer and a first wiring structure, the first semiconductor layer including a plurality of photoelectric conversion units;
- a second substrate that includes a second semiconductor layer and a second wiring structure, the second semiconductor layer including a plurality of pixel circuits provided in such a way as to correspond to the plurality of photoelectric conversion units;
- a third substrate that includes a third semiconductor layer and a third wiring structure, the third semiconductor layer including a signal processing circuit configured to process signals outputted from the plurality of pixel circuits;
- and
- first through-hole wiring going through the third semiconductor layer,
- wherein each of the plurality of photoelectric conversion units includes an avalanche diode,
- wherein the first substrate and the second substrate are stacked such that the first wiring structure and the second wiring structure are provided between the first semiconductor layer and the second semiconductor layer,
- wherein the second substrate and the third substrate are stacked such that the third wiring structure is provided between the second semiconductor layer and the third semiconductor layer;
- and
- wherein a first connection number, which is a number of pieces of wiring for connecting wiring of the first wiring structure and wiring of the second wiring structure by way of a junction surface of the first substrate and the second substrate, is greater than a second connection number, which is a number of pieces of wiring for connecting wiring of the second wiring structure and wiring of the third wiring structure by way of a junction surface of the second substrate and the third substrate;
- and
- a pixel area where the plurality of photoelectric conversion units is provided, wherein
- in the pixel area, the first connection number is greater than the second connection number.
A photoelectric conversion apparatus comprising:
- a first substrate that includes a first semiconductor layer and a first wiring structure, the first semiconductor layer including a plurality of photoelectric conversion units;
- a second substrate that includes a second semiconductor layer and a second wiring structure, the second semiconductor layer including a plurality of pixel circuits provided in such a way as to correspond to the plurality of photoelectric conversion units;
- a third substrate that includes a third semiconductor layer and a third wiring structure, the third semiconductor layer including a signal processing circuit configured to process signals outputted from the plurality of pixel circuits;
- first through-hole wiring going through the third semiconductor layer;
- and
- a time measurement circuit, wherein
- each of the plurality of photoelectric conversion units includes an avalanche diode,
- the first substrate and the second substrate are stacked such that the first wiring structure and the second wiring structure are provided between the first semiconductor layer and the second semiconductor layer,
- the second substrate and the third substrate are stacked such that the third wiring structure is provided between the second semiconductor layer and the third semiconductor layer,
- the time measurement circuit is provided in the second substrate, and
- the time measurement circuit is shared by the plurality of photoelectric conversion units.
Dependencies are inferred from the claim text.