Two-dimensional power clamp cell

A power clamp cell, comprising:

• a power clamping circuit;
• a power routing in two directions, wherein the power routing has at least a first vertical metal line and a first horizontal metal line, and the power routing is implemented by using a first metal layer in semiconductor process;
• and
• a ground routing in two directions, wherein the ground routing has at least a second vertical metal line and a second horizontal metal line, and the ground routing is implemented by using a second metal layer in the semiconductor process;
• wherein the power clamping circuit comprises:
• a trigger circuit, configured to receive an electrostatic discharge (ESD) detection signal to generate a trigger signal, wherein the ESD detection signal is used to indicate if an ESD occurs;
• and
• a clamp device, coupled between a supply voltage and a ground voltage, configured to be enabled or disabled according to the trigger signal;
• wherein the trigger circuit comprises an inverter comprising a first P-type Metal Oxide Semiconductor (PMOS) and a first N-type Metal Oxide Semiconductor (NMOS), and the clamp circuit comprises a first NMOS;
• and the first PMOS is positioned in a corner of the power clamp circuit, and the first NMOS and the second NMOS are positioned in other three corners of the power clamp circuit.

A power clamp group, comprising:

• a plurality of power clamp cells comprising at least a first power clamp cell, a second power clamp cell and a third power clamp cell, wherein the plurality of power clamp cells have the same circuit design, the first power clamp cell is immediately connected to the second power clamp cell in a vertical direction, and the first power clamp cell is immediately connected to the third power clamp cell in a horizontal direction;
• wherein each power clamp cell comprises:
• a power clamping circuit;
• a power routing in two directions, wherein the power routing has at least a first vertical metal line and a first horizontal metal line, and the power routing is implemented by using a first metal layer in semiconductor process;
• and
• a ground routing in two directions, wherein the ground routing has at least a second vertical metal line and a second horizontal metal line, and the ground routing is implemented by using a second metal layer in the semiconductor process;
• wherein the power clamping circuit comprises:
• a trigger circuit, configured to receive an electrostatic discharge (ESD) detection signal to generate a trigger signal, wherein the ESD detection signal is used to indicate if an ESD occurs;
• and
• a clamp device, coupled between a supply voltage and a ground voltage, configured to be enabled or disabled according to the trigger signal;
• wherein the power clamp cell further comprises a global routing, wherein the global routing comprises a third vertical metal line and a third horizontal metal line for a transmission of the ESD detection signal.

A power clamp group, comprising:

• a plurality of power clamp cells comprising at least a first power clamp cell, a second power clamp cell and a third power clamp cell, wherein the plurality of power clamp cells have the same circuit design, the first power clamp cell is immediately connected to the second power clamp cell in a vertical direction, and the first power clamp cell is immediately connected to the third power clamp cell in a horizontal direction;
• wherein each power clamp cell comprises:
• a power clamping circuit;
• a power routing in two directions, wherein the power routing has at least a first vertical metal line and a first horizontal metal line, and the power routing is implemented by using a first metal layer in semiconductor process;
• and
• a ground routing in two directions, wherein the ground routing has at least a second vertical metal line and a second horizontal metal line, and the ground routing is implemented by using a second metal layer in the semiconductor process;
• wherein the power clamping circuit comprises:
• a trigger circuit, configured to receive an electrostatic discharge (ESD) detection signal to generate a trigger signal, wherein the ESD detection signal is used to indicate if an ESD occurs;
• and
• a clamp device, coupled between a supply voltage and a ground voltage, configured to be enabled or disabled according to the trigger signal;
• wherein the trigger circuit comprises an inverter comprising a first P-type Metal Oxide Semiconductor (PMOS) and a first N-type Metal Oxide Semiconductor (NMOS), and the clamp circuit comprises a first NMOS;
• and the first PMOS is positioned in a corner of the power clamp circuit, and the first NMOS and the second NMOS are positioned in other three corners of the power clamp circuit.