Image pickup unit, method of manufacturing image pickup unit, and endoscope

An image pickup unit comprising:

• an image pickup substrate having a first principal surface and a second principal surface and including an image pickup device, a first electrode of the image pickup device being connected to a second electrode disposed on the second principal surface;
• a first wiring plate having a third principal surface, a fourth principal surface, and a first side surface, a third electrode on the third principal surface being bonded to the second electrode;
• and
• a second wiring plate having a fifth principal surface, a sixth principal surface, and a second side surface, a fifth electrode on the fifth principal surface and a sixth electrode on the second side surface being bonded to a fourth electrode on the fourth principal surface of the first wiring plate by using solder, the sixth electrode being extended from the fifth electrode,
• wherein
• a first conductor block is embedded in the second wiring plate, an exposed surface of the first conductor block on the fifth principal surface being the fifth electrode, an exposed surface of the first conductor block on the second side surface being the sixth electrode,
• the solder bonding the fourth electrode and the sixth electrode forms a fillet;
• the second wiring plate is a multi-layer board in which a plurality of wiring layers are stacked in an optical axis direction, the plurality of wiring layers including two wiring layers in each of which a third conductor block and a fourth conductor block are embedded,
• an interval between the two wiring layers in each of which the fourth conductor blocks are embedded among the plurality of wiring layers is substantially equal to an interval between two chip electrodes of a chip component,
• the chip electrodes are bonded to chip lands that are exposed surfaces of the fourth conductor blocks of the two wiring layers, the exposed surfaces being exposed on one side surface of the second wiring plate,
• the cable is bonded to cable lands that are exposed surfaces of the third conductor blocks of the two wiring layers, the exposed surfaces being exposed on a side surface opposite the one side surface, and
• an interval between the chip lands is equal to an interval between the cable lands in the optical axis direction.

An image pickup unit comprising:

• an image pickup substrate having a first principal surface and a second principal surface and including an image pickup device, a first electrode of the image pickup device being connected to a second electrode disposed on the second principal surface;
• a first wiring plate having a third principal surface, a fourth principal surface, and a first side surface, a third electrode on the third principal surface being bonded to the second electrode;
• a second wiring plate having a fifth principal surface, a sixth principal surface, and a second side surface, the second wiring plate being a multi-layer board in which a plurality of wiring layers are stacked in an optical axis direction, an interval between two wiring layers in each of which a third conductor block and a fourth conductor block are embedded among the plurality of wiring layers being substantially equal to an interval between two chip electrodes of a chip component;
• the chip component the two chip electrodes of which are bonded to two chip lands that are exposed surfaces of the fourth conductor blocks of the two wiring layers, the exposed surfaces being exposed on the second side surface;
• and
• a cable bonded to any of cable lands that are exposed surfaces of the third conductor blocks of the two wiring layers, the exposed surfaces being exposed on a side surface opposite the second side surface,
• wherein a disposition pitch between the chip lands is equal to a disposition pitch between the cable lands in the optical axis direction.