Clock generator with dual-path temperature compensation

A multi-die integrated circuit comprising:

• a die stack, including a first die and a circuits' die, stacked together in a flip-chip arrangement;
• the first die having thereon a microelectromechanical systems (MEMS) resonator, wherein the MEMS resonator has a stiffness that is characterized by a temperature-dependent variation;
• the circuits' die having circuitry to receive a first signal, the first signal representing a frequency of vibration of the MEMS resonator, and to generate therefrom an oscillation signal for output by the multi-die integrated circuit;
• wherein the circuitry is further operable to:
• receive a second signal representing a sensed temperature of the MEMS resonator,
• generate a correction signal, as a function of the sensed temperature,
• apply the correction signal onboard the multi-die integrated circuit, to reduce variation in a frequency represented by the oscillation signal, relative to the temperature-dependent variation of the stiffness;
• and
• output, to a device external to the multi-die integrated circuit:
• the oscillation signal;
• and
• at least one signal that conveys to the device the sensed temperature and information representing frequency behavior of the oscillation signal as a function of the sensed temperature, for compensation, external to the multi-die integrated circuit, of the additional frequency error in the oscillation signal.

An apparatus comprising:

• a multi-die oscillator integrated circuit, having:
• a first die having thereon a microelectromechanical systems (MEMS) resonator, wherein the MEMS resonator has a stiffness that is characterized by a temperature-dependent variation;
• and
• a circuits' die having first circuitry to receive a first signal, the first signal representing a frequency of vibration of the MEMS resonator, and to generate therefrom an oscillation signal for output by the multi-die integrated circuit;
• and
• a device external to the multi-die oscillator integrated circuit, the device having second circuitry;
• wherein the first circuitry is further operable to:
• receive a second signal representing a sensed temperature of the MEMS resonator,
• generate a correction signal, as a function of the sensed temperature,
• apply the correction signal onboard the multi-die integrated circuit, to reduce variation in a frequency represented by the oscillation signal, relative to the temperature-dependent variation of the stiffness;
• output, to the device external to the multi-die integrated circuit:
• the oscillation signal;
• and
• at least one signal that conveys to the device the sensed temperature and information representing frequency behavior of the oscillation signal as a function of the sensed temperature;
• wherein the second circuitry is operable to electronically compensate for additional frequency error in the oscillation signal by generating a timing signal from the oscillation signal, the timing signal having reduced temperature-dependent variation in frequency relative to the oscillation signal.