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US 12,732,141 B2Granted
Isolated switching amplifier system
AssigneeYank Technologies, Inc.
InventorsJoshua Aaron Yankowitz, Monika Chaudhari
Life of this patent
Estimating the term…
Abstract
A switching amplifier system includes an amplifier printed circuit board (PCB); a filter PCB coupled to the amplifier PCB and configured to receive an amplified signal from the amplifier PCB, and a resonant capacitor PCB coupled to the filter PCB and to one or more antennas The resonant capacitor PCB is physically separated from the amplifier PCB and the filter PCB by a distance of at least 10 mm. The filter PCB is physically separated from the amplifier PCB by a distance of at least 10 mm.
Claims17
A switching amplifier system, comprising:
- an amplifier printed circuit board (PCB);
- a filter PCB coupled to the amplifier PCB and configured to receive an amplified signal from the amplifier PCB;
- a resonant capacitor PCB coupled to the filter PCB and to one or more antennas, wherein the resonant capacitor PCB is physically separated from the amplifier PCB and the filter PCB by a distance of at least 10 mm, wherein the resonant capacitor PCB is configured to receive a filtered signal from the filter PCB and drive the filtered signal onto the one or more antennas, and wherein the resonant capacitor PCB is configured to apply an oscillating voltage of at least 100 Volts across the one or more antennas, wherein the physical separation between the resonant capacitor PCB and the amplifier PCB isolates the oscillating voltage from switching components on the amplifier PCB, wherein the physical separation between the filter PCB and the one or more antennas reduces hysteresis losses in one or more inductive filter components of the filter PCB caused by coupling between a radiated wireless power signal from the one or more antennas and the one or more inductive filter components, and wherein the filtered signal is generated by filtering the amplified signal through a radio frequency (RF) filter in the filter PCB.
A method for fabricating a wireless charging system, the method comprising:
- attaching an amplifier printed circuit board (PCB) to a first area of an electrically non-conductive support structure;
- attaching a filter PCB to a second area of the support structure, wherein the filter PCB is electrically coupled to the amplifier PCB and is configured to receive an amplified signal from the amplifier PCB;
- attaching a resonant capacitor PCB to a third area of the support structure,
- wherein the resonant capacitor PCB is electrically coupled to the filter PCB and to one or more antenna coils and is configured to receive a filtered signal from the filter PCB and drive the filtered signal onto the one or more antenna coils,
- wherein the first area, the second area, and the third area of the support structure are selected to maintain a physical separation between the amplifier PCB, the resonant capacitor PCB, the filter PCB, and the one or more antenna coils,
- wherein a distance of the physical separation between the filter PCB and the resonant capacitor PCB is at least 10 mm,
- wherein the resonant capacitor PCB is configured to apply an oscillating voltage of at least 100 Volts across the one or more antenna coils,
- wherein the physical separation between the resonant capacitor PCB and the amplifier PCB isolates the oscillating voltage from switching components on the amplifier PCB,
- wherein the physical separation between the filter PCB and the one or more antenna coils reduces hysteresis losses in one or more inductive filter components of the filter PCB caused by coupling between a radiated wireless power signal from the one or more antenna coils and the one or more inductive filter components.
6 more elements
A method for fabricating a wireless charging system, the method comprising:
- attaching an amplifier printed circuit board (PCB) to a first area of a first support structure, wherein the first support structure is electrically non-conductive;
- attaching a first filter PCB to a second area of the first support structure, wherein the first filter PCB is electrically coupled to the amplifier PCB and is configured to receive an amplified signal from the amplifier PCB;
- attaching a resonant capacitor PCB to a second support structure,
- wherein the second support structure is separate from the first support structure,
- wherein the resonant capacitor PCB is electrically coupled to the first filter PCB and to one more antenna coils, and
- wherein a distance of a physical separation between the resonant capacitor PCB and the first filter PCB is at least 10 mm,
- wherein the resonant capacitor PCB is configured to apply an oscillating voltage of at least 100 Volts across the one or more antenna coils,
- wherein the physical separation between the resonant capacitor PCB and the amplifier PCB isolates the oscillating voltage from switching components on the amplifier PCB,
- wherein the physical separation between the filter PCB and the one or more antenna coils reduces hysteresis losses in one or more inductive filter components of the filter PCB caused by coupling between a radiated wireless power signal from the one or more antenna coils and the one or more inductive filter components.
6 more elements
Dependencies are inferred from the claim text.