X-type multilevel converter systems including interleaved topologies for mutual inductance cancellation

A multi-phase power inverter for an electric propulsion system, the multi-phase power inverter comprising:

• a plurality of X-type multilevel power converters arranged to transfer electric power between a high-voltage direct current (DC) power supply and an electric machine, wherein each of the plurality of X-type multilevel power converters is a solid-state integrated circuit (IC) including:
• a first leg;
• and
• a second leg, each of the first leg and the second leg including:
• a positive DC power bus;
• a negative DC power bus;
• a neutral bus;
• a first alternating current (AC) bus;
• a second AC bus;
• a first conductive layer;
• a second conductive layer;
• and
• wherein the first leg further includes:
• a first plurality of semiconductor switches including a third semiconductor switch, a fourth semiconductor switch, a fifth semiconductor switch, and a sixth semiconductor switch;
• a first clamping diode;
• and
• a first plurality of conductive spacers arranged between the first clamping diode and a first portion of the first conductive layer;
• and
• wherein the second leg further includes:
• a second plurality of semiconductor switches including a first semiconductor switch, a second semiconductor switch, a seventh semiconductor switch, and an eighth semiconductor switch;
• a second clamping diode;
• and
• a second plurality of conductive spacers arranged between the second clamping diode and the first conductive layer;
• and
• wherein the first plurality of semiconductor switches, the first leg positive DC power bus, the first leg negative DC power bus, the first leg first AC bus, the first leg second AC bus, the first leg first conductive layer, the first leg second conductive layer, and the first clamping diode are arranged into a plurality of tiers including:
• a first tier composed of the first leg first AC bus arranged coplanar with the first leg second AC bus arranged coplanar with the first portion of the first leg first conductive layer that is arranged coplanar with the first leg positive DC power bus that is arranged coplanar with the first leg negative DC power bus;
• a second tier composed of the first clamping diode arranged coplanar with the third semiconductor switch arranged coplanar with the fourth semiconductor switch that is arranged coplanar with the fifth semiconductor switch that is arranged coplanar with the sixth semiconductor switch;
• and
• a third tier composed of a second portion of the first leg first conductive layer;
• and
• wherein the second plurality of semiconductor switches, the second leg positive DC power bus, the second leg negative DC power bus, the second leg first AC bus, the second leg second AC bus, the second leg first conductive layer, the second leg second conductive layer, and the second clamping diode are arranged into a plurality of tiers including:
• a first tier composed of the second leg first AC bus arranged coplanar with the second leg second AC bus arranged coplanar with the first portion of the second leg first conductive layer that is arranged coplanar with the second leg first positive DC power bus that is arranged coplanar with the second leg negative DC power bus;
• a second tier composed of the second clamping diode arranged coplanar with the first semiconductor switch arranged coplanar with the second semiconductor switch that is arranged coplanar with the seventh semiconductor switch that is arranged coplanar with the eighth semiconductor switch;
• and
• a third tier composed of a second portion of the second leg first conductive layer;
• and
• wherein the first leg and the second leg are electrically connected by interconnections arranged between the first leg first AC bus and the second leg first AC bus, and the second leg second AC bus and the second leg second AC bus.

A vehicle including an electric propulsion system, the vehicle comprising:

• an electric propulsion system installed in a vehicle, the electric propulsion system including:
• an electric motor configured to provide power to the electric propulsion system;
• and
• a multi-phase power inverter for an electric propulsion system, the multi-phase power inverter comprising:
• a plurality of X-type multilevel power converters arranged to transfer electric power between a high-voltage direct current (DC) power supply and an electric machine, wherein each of the plurality of X-type multilevel power converters is a solid-state integrated circuit (IC) including:
• a first leg;
• and
• a second leg, each of the first leg and the second leg including:
• a positive DC power bus;
• a negative DC power bus;
• a neutral bus;
• a first alternating current (AC) bus;
• a second AC bus;
• a first conductive layer;
• a second conductive layer;
• and
• wherein the first leg further includes:
• a first plurality of semiconductor switches including a third semiconductor switch, a fourth semiconductor switch, a fifth semiconductor switch, and a sixth semiconductor switch;
• a first clamping diode;
• and
• a first plurality of conductive spacers arranged between the fifth semiconductor switch and the positive DC power bus, the sixth semiconductor switch and the first AC bus, the fourth semiconductor switch and the second conductive layer, and the third semiconductor switch and the second conductive layer;
• and
• wherein the second leg further includes:
• a second plurality of semiconductor switches including a first semiconductor switch, a second semiconductor switch, a seventh semiconductor switch, and an eighth semiconductor switch;
• a second clamping diode;
• a second plurality of conductive spacers arranged between the first semiconductor switch and the positive DC power bus;
• the second semiconductor switch and the second AC bus;
• the eighth semiconductor switch and the second conductive layer;
• the seventh semiconductor switch and the second conductive layer;
• and the first clamping diode and the second conductive layer;
• and
• wherein the first plurality of semiconductor switches, the first leg positive DC power bus, the first leg negative DC power bus, the first leg first AC bus, the first leg second AC bus, the first leg first conductive layer, the first leg second conductive layer, and the first clamping diode are arranged into a first plurality of tiers;
• wherein the second plurality of semiconductor switches, the second leg positive DC power bus, the second leg negative DC power bus, the second leg first AC bus, the second leg second AC bus, the second leg first conductive layer, the second leg second conductive layer, and the second clamping diode are arranged into a second plurality of tiers;
• and
• wherein the first leg and the second leg are electrically connected by interconnections arranged between the first AC bus of the first leg and the first AC bus of the second leg, and the second AC bus of the first leg and the second AC bus of the second leg.