Plug connection for high-frequency-based field devices
AssigneeEndress + Hauser Flowtec AG
InventorsMarkus Beissert, Frank Voigt, Thilo Ihringer
Life of this patent
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Abstract
The present disclosure relates to a high-frequency plug connection for high-frequency-based field devices, consisting of plugs and corresponding sockets. The high-frequency plug connection is characterized in that the at least one plug is resiliently enclosed by an enclosure such that this/these plug(s) is/are moveable radially with respect to its/their plugging axis. This has the advantage of reducing the risk of jamming against the enclosure when the plugs are inserted in the corresponding sockets, during fastening of the circuit board substrate on which the sockets are arranged. A modular design of the high-frequency-based field device, and the manufacturability thereof, are simplified as a result.
Claims9
A high-frequency-based field device for determining a process variable of a medium in a container, comprising:
- at least one transmitting and/or receiving antenna which can be attached to the container in order to transmit a high-frequency signal toward the medium, and/or to receive the high-frequency signal after interacting with the medium,
- a device neck which can be arranged on the container in order to contact the at least one antenna,
- an enclosure which resiliently encloses at least one plug in such a way that the at least one plug is movable with respect to the enclosure radially with respect to a plugging axis thereof, wherein the enclosure is inserted in the device neck in such a way that the at least one plug is in each case contacted to the at least one antenna,
- a high-frequency module comprising
- a circuit board substrate on which at least one socket corresponding to the at least one plug is arranged, and
- an electronic unit arranged on the circuit board substrate, wherein the electronic unit is designed to generate the high-frequency signal to be coupled, and to determine the process variable on the basis of the received high-frequency signal, wherein the electronic unit is connected to the at least one socket for this purpose, and
- wherein the circuit board substrate can be fastened to the enclosure in the device neck in such a way that the at least one plug is inserted into the at least one socket.
Dependencies are inferred from the claim text.