Lower deposition chamber CCP electrode cleaning solution

A process chamber, comprising:

• a lid assembly;
• a chamber body coupled to the lid assembly by a spacer, the spacer and the chamber body defining a process volume, the spacer having a height of about 0.5 inches to about 20 inches;
• a seal disposed at the interface of the spacer and the chamber body;
• a substrate transfer port disposed through the spacer;
• a substrate support disposed and movable within the process volume;
• an electrode cleaning ring disposed below the substrate transfer port, and around a perimeter of and within a lower portion of the process volume, wherein the electrode cleaning ring is positioned below at least an upper surface of the substrate support;
• a radiofrequency (RF) power feed-through disposed through the chamber body and a chamber liner coupled to the chamber body in the process volume, wherein the RF power feed-through is coupled to the electrode cleaning ring;
• and
• a cleaning RF power source conductively coupled to the electrode cleaning ring via the RF power feed-through.