Energy filter assembly for ion implantation system with at least one coupling element
AssigneeMi2-Factory GmbH
InventorsConstantin Csato, Florian Krippendorf, André Zowalla
Life of this patent
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Abstract
An energy filter assembly (1, 100, 200, 300) for ion implantation system is provided comprising an energy filter (25), a first filter frame (40), and at least one coupling element (50). The energy filter (25) has at least one filter element (25a) absorbing the beam energy of an ion beam (10). The at least one coupling element (50) elastically connects the first filter frame (40) with the energy filter (25).
Claims28
An energy filter assembly for ion implantation system, comprising:
- an energy filter having at least one filter element absorbing the beam energy of an ion beam;
- a first filter frame;
- and
- at least one coupling element for elastically connecting the first filter frame with the energy filter, wherein the at least one coupling element is preloaded for keeping the connection between the first filter frame and the energy filter under a controlled tension.
An energy filter assembly for ion implantation system, comprising:
- an energy filter having at least one filter element absorbing the beam energy of an ion beam;
- a first filter frame;
- at least one coupling element for elastically connecting the first filter frame with the energy filter;
- at least one aperture element arranged in a plane, which is perpendicular to the beam direction of the ion beam;
- a substrate, wherein the at least one aperture element is arranged between the energy filter and the substrate such that a filtered ion beam is transmitted to the substrate;
- and
- at least one detecting element scanning the ion beam in at least one minimal scanning area, wherein the at least one detecting element is scanning the ion beam in a scanning area, wherein the scanning area extends beyond the at least one detecting element.
A method for manufacturing an energy filter assembly for ion implantation system, comprising the steps of:
- providing an energy filter having at least one filter element absorbing the beam energy of an ion beam;
- providing a first filter frame;
- and
- connecting the first filter frame with the energy filter by at least one coupling element for elastically connecting the first filter frame with the energy filter.
A method for filtering ion implantation, the method comprising the steps of:
- providing an energy filter assembly comprising an energy filter having at least one filter element, wherein a first filter frame is elastically connected with the energy filter by at least one coupling element and wherein at least one aperture element is arranged between the energy filter and a substrate;
- providing an ion beam extending across the energy filter, and the at least one coupling element;
- and
- arranging the at least one aperture element with respect to the direction of the ion beam, such that non-filtered ions of the ion beam are stopped from impacting on the substrate.
A method for manufacturing an energy filter for an ion implantation system, wherein the energy filter assembly comprises a first filter frame and at least one coupling element, and wherein method comprises the steps of:
- providing a silicon-on-insulator wafer as a substrate material having a first surface and a second surface, wherein the thickness of a buried oxide varies between 30 nm and 1.5 μm thickness;
- applying a first masking material layer and a second masking material layer for masking wet chemical potassium hydroxide etching or tetramethylammonium hydroxide etching to the first surface and the second surface of the SOI wafer;
- patterning the first masking material layer and the second masking material layer on the first surface and the second surface by using a first and second lithography process step and at least one wet or dry etching patterning step;
- cleaning of the first and second surfaces after patterning of the masking material layers;
- first wet chemical etching of the first or second surfaces using KOH or TMAH etchant;
- removing of the first masking material layer;
- applying a third masking material layer on the first surface, for masking a KOH or TMAH wet etching step OR dry etching step to the first surface of the SOI wafer;
- patterning the third masking material layers on the first surface by using a third lithography process step and at least one wet or dry etching patterning step;
- applying a KOH or TMAH wet etching step OR dry etching step to the first surface of the SOI wafer stopping on the BOX layer;
- second wet chemical etching of the first or the second surface using KOH or TMAH etchant;
- third wet chemical etching or dry etching of the second surface such that etching is stopped on the BOX layer;
- removing of the BOX layer;
- and
- removing of the masking layers on the first and second surfaces.
A method for manufacturing an energy filter assembly for an ion implantation system, the method comprising the steps of:
- providing a volume material slab;
- sequentially removing of the material by a laser etching or mechanical erosive device, wherein the removing is incremental several 10 nm up to several micrometer per step and involves several removal steps for a given structure, and wherein the sequentially removing is performed according to a predefined 3-D layout of an energy filter, a first filter frame, and at least one coupling element for elastically connecting the first filter frame with the energy filter.
A method for manufacturing an energy filter assembly for an ion implantation system, the method comprising the steps of:
- providing a substrate or base layer;
- depositing a first filter layer for providing an energy filter and a first filter frame layer for providing a first filter frame;
- patterning the first filter layer and the first filter frame layer using suitable etching techniques like masked etching or sequential etching by a laser or ion beam etching device;
- depositing and patterning sequentially multiples of first filter layers and first filter frame layers;
- removing, grinding or etching the substrate or base layer to a desired substrate layer thickness or base layer thickness;
- and
- removing, grinding or etching the first filter layers and first filter frame layers cutting out at least one coupling element for elastically connecting the first filter frame with the energy filter.
A method for manufacturing an energy filter assembly for an ion implantation system, the method comprising the steps of:
- providing an energy filter;
- providing a first filter frame;
- creating at least one elastic element between the energy filter and the first filter frame by laser ablation;
- and
- separating the energy filter from first filter frame by material ablation.
Dependencies are inferred from the claim text.