Communication assembly and heat dissipation shielding module thereof

A communication assembly configured to be disposed on a substrate, and the communication assembly comprising:

• an optical fiber communication module configured to disposed on the substrate;
• and
• a heat dissipation shielding module configured for cooling the optical fiber communication module and shielding the optical fiber communication module from external electromagnetic interference, and the heat dissipation shielding module comprising:
• a shielding cover configured to be disposed on the substrate, the shielding cover and the substrate together surrounding and forming an accommodation space, the optical fiber communication module located in the accommodation space, and the shielding cover in thermal contact with the optical fiber communication module;
• and
• a heat sink disposed on the shielding cover;
• wherein the heat dissipation shielding module is made of a single material, and the shielding cover and the heat sink are integrated regions of the single material and are not separated by an interface formed by stacking separate components.