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US 12,730,259 B2Granted
Low loss splitter-combiner waveguide structures in photonic circuits
AssigneeIntel Corporation
InventorsBoris Vulovic, Wenhua Lin
Life of this patent
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Abstract
Disclosed herein are embodiments of a waveguide structure, comprising: a deep rib waveguide on a slab and a plurality of shallow rib waveguides on the slab. The deep rib waveguide has a first etch-depth, the plurality of shallow rib waveguides has a second etch-depth, and the first etch-depth is greater than the second etch-depth.
Claims20
A waveguide structure, comprising:
- a first rib waveguide on a slab;
- and
- a plurality of second rib waveguides on the slab, wherein:
- the first rib waveguide has a first height,
- the plurality of second rib waveguides has a second height, and
- the first height is greater than the second height,
- the first rib waveguide is coupled to the plurality of second rib waveguides at an etch boundary,
- the slab has a first thickness starting at one side of the etch boundary and the first rib waveguide is at the one side of the etch boundary, and
- the slab has a second thickness starting at another side of the etch boundary and the plurality of second rib waveguides are at the another side of the etch boundary.
6 more elements
A photonic device, comprising:
- a photonic integrated circuit (PIC);
- and
- an optical coupling component coupled with the PIC,
- wherein the PIC includes a waveguide structure comprising a first rib waveguide on a slab and a plurality of second rib waveguides on the slab, and wherein:
- the first rib waveguide has a first height,
- the plurality of second rib waveguides has a second height,
- the first height is greater than the second height,
- the first rib waveguide is coupled to the plurality of second rib waveguides at an etch boundary,
- the slab has a first thickness starting at one side of the etch boundary and the first rib waveguide is at the one side of the etch boundary, and
- the slab has a second thickness starting at another side of the etch boundary and the plurality of second rib waveguides are at the another side of the etch boundary.
7 more elements
An integrated circuit (IC) package, comprising:
- a die;
- and
- an IC component coupled with the die,
- wherein the die includes a waveguide structure comprising a first rib waveguide on a slab and a plurality of second rib waveguides on the slab, and wherein:
- the first rib waveguide has a first height,
- the plurality of second rib waveguides has a second height,
- the first height is greater than the second height,
- the first rib waveguide is coupled to the plurality of second rib waveguides at an etch boundary,
- the slab has a first thickness starting at one side of the etch boundary and the first rib waveguide is at the one side of the etch boundary, and
- the slab has a second thickness starting at another side of the etch boundary and the plurality of second rib waveguides are at the another side of the etch boundary.
7 more elements
Dependencies are inferred from the claim text.