Manufacturing method of radiation imaging apparatus, radiation imaging apparatus, and radiation imaging system
AssigneeCanon Kabushiki Kaisha
InventorsTaiji Tomita, Masato Ofuji
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Abstract
A manufacturing method of a radiation imaging apparatus is provided. The radiation imaging apparatus includes a sensor substrate and a scintillator that are bonded by a bonding member. The manufacturing method includes: preparing a support substrate on which the scintillator has been formed; bonding the sensor substrate and the scintillator via the bonding member; and separating the support substrate after the bonding. The bonding is performed under reduced pressure.
Claims14
A manufacturing method of a radiation imaging apparatus in which a sensor substrate and a scintillator are bonded by a bonding member, the method comprising:
- preparing a support substrate on which the scintillator has been formed;
- bonding the sensor substrate and the scintillator via the bonding member;
- and
- separating the support substrate after the bonding,
- wherein the bonding is performed under reduced pressure,
- wherein the sensor substrate comprises a main surface with a plurality of pixels arranged thereon,
- wherein a bubble exists in the bonding member over a first pixel of the plurality of pixels, and
- wherein in an orthogonal projection with respect to the main surface, no bubble extends over both the first pixel and an adjacent pixel adjacent to the first pixel in the bonding member.
A radiation imaging apparatus in which a scintillator and a sensor substrate comprising a main surface with a plurality of pixels arranged thereon are bonded by a bonding member,
- wherein a bubble exists in the bonding member over a first pixel of the plurality of pixels, and
- wherein in an orthogonal projection with respect to the main surface, no bubble extends over both the first pixel and an adjacent pixel adjacent to the first pixel in the bonding member.
Dependencies are inferred from the claim text.