Communication of thermal states for chiplets

A method comprising:

• receiving one or more thermal signals from one or more thermal sensors in response to a temperature of a chiplet;
• combining the one or more thermal signals on the chiplet to generate a combined thermal signal;
• comparing the combined thermal signal to a high threshold;
• comparing the combined thermal signal to a low threshold;
• generating a temperature signal on the chiplet in response to the combined thermal signal exceeding the high threshold;
• asserting the temperature signal on an external connector of the chiplet to an external component for a thermal mitigation;
• and
• de-asserting the temperature signal in response to the combined thermal signal being less than the low threshold.

A chiplet comprising:

• a die-to-die interface coupled to one or more chiplets configured to receive combined thermal signals from the one or more chiplets;
• a chiplet thermal combiner coupled to the die-to-die interface configured to receive the combined thermal signals and configured to generate a temperature signal in response thereto, wherein the temperature signal indicates that at least one of the one or more chiplets has a thermal signal exceeding a high threshold;
• and
• an external connector configured to assert the temperature signal to an external component for a thermal mitigation, and to de-assert the temperature signal in response to the at least one of the one or more chiplets having a thermal signal being less than a low threshold.

A method comprising:

• receiving aggregated thermal signals at a chiplet thermal combiner on a primary chiplet from one or more chiplets through a die-to-die interface coupled to the one or more chiplets;
• comparing the aggregated thermal signals to a high threshold;
• comparing the aggregated thermal signals to a low threshold;
• generating a temperature signal on the primary chiplet in response to the aggregated thermal signals exceeding the high threshold;
• asserting the temperature signals through an external connector of the primary chiplet to an external component to activate a thermal mitigation;
• and
• de-asserting the temperature signal in response to the combined thermal signal being less than the low threshold.