Wafer temperature sensor including optical fiber, wafer temperature sensor system, and method of manufacturing wafer temperature sensor
AssigneeSamsung Electronics Co., Ltd.
InventorsYoshiaki Moriya, Noriaki Imai
Life of this patent
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Abstract
A wafer temperature sensor includes a first wafer, a second wafer, and a fiber bragg gratings (FBG)-type optical fiber, wherein the first wafer and the second wafer are bonded to each other, wherein at least one of a bonding surface of the first wafer and a bonding surface of the second wafer comprises a spiral groove, wherein the FBG-type optical fiber is in the spiral groove, and wherein the FBG-type optical fiber comprises a plurality of temperature measurement points in the spiral groove.
Claims20
A wafer temperature sensor comprising:
- a first wafer, a second wafer, and a plurality of fiber bragg gratings (FBG)-type optical fibers,
- wherein a first surface of the first wafer and a first surface of the second wafer are bonded to each other,
- wherein at least one of the first surface of the first wafer and the first surface of the second wafer comprises a plurality of spiral grooves,
- wherein each FBG-type optical fiber, of the plurality of FBG-type optical fibers, is in a respective groove of the plurality of spiral grooves, and
- wherein the FBG-type optical fiber comprises a plurality of temperature measurement points in the spiral groove.
A wafer temperature sensor comprising:
- a first wafer;
- a second wafer bonded to the first wafer;
- and
- a plurality of fiber bragg gratings (FBG)-type optical fibers disposed in a plurality of spiral grooves included in at least one of the first wafer and the second wafer,
- wherein each of the plurality of FBG-type optical fibers comprises a plurality of temperature measurement points,
- wherein the plurality of FBG-type optical fibers do not intersect each other and each FBG-type optical fiber, of the plurality of FBG-type optical fibers is in a respective groove of the plurality of spiral grooves, and
- wherein each of the plurality of temperature measurement points comprises a grating in which a plurality of reflective patterns having spacing changed by temperature are disposed.
A wafer temperature sensor system comprising:
- a first wafer, a second wafer, a plurality of fiber bragg gratings (FBG)-type optical fibers, a detector including a light emitter and a light receiver, an optical cable configured to relay light between the FBG-type optical fiber and the detector, and a computer configured to process a signal from the light receiver,
- wherein a first surface of the first wafer and a first surface of the second wafer are bonded to each other,
- wherein at least one of the first surface of the first wafer and the first surface of the second wafer comprises a plurality of spiral grooves,
- wherein each FBG-type optical fiber, of the plurality of FBG-type optical fibers, is in a respective groove of the plurality of spiral grooves, and
- wherein the FBG-type optical fiber comprises a plurality of temperature measurement points in the groove.
Dependencies are inferred from the claim text.