Heat pump system
AssigneeSamsung Electronics Co., Ltd.
InventorSoonjae Pyo
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorSoonjae Pyo
Estimating the term…
A heat pump system in which a heat source is air, and may include: a compressor configured to compress a refrigerant, a first heat exchanger configured to exchange heat between the refrigerant and air, a second heat exchanger configured to exchange heat between the refrigerant and water, a first refrigerant pipe configured to discharge the refrigerant heat exchanged in the first heat exchanger during a defrosting operation for the first heat exchanger, and a second refrigerant pipe configured to guide the refrigerant from the first refrigerant pipe to the second heat exchanger. The heat pump system may further include: a third refrigerant pipe configured to discharge the refrigerant heat exchanged in the second heat exchanger after flowing into the second heat exchanger through the second refrigerant pipe, a first water pipe configured to supply water to be heat exchanged in the second heat exchanger, a second water pipe configured to return the water heat exchanged in the second heat exchanger, a bypass pipe connecting the first refrigerant pipe and the third refrigerant pipe and configured to bypass the second heat exchanger, and a third heat exchanger configured to heat exchange the refrigerant guided by the bypass pipe with the water flowing in the second water pipe, during the defrosting operation.
A heat pump system, comprising:
A heat pump system, comprising:
A heat pump system, comprising:
Dependencies are inferred from the claim text.