Curing-reactive organopolysiloxane resin, pressure-sensitive adhesive composition using same, and use thereof

An electronic part or a display device containing an electronic material or member for a display device, the electronic material or member being obtained by curing a curing-reactive organopolysiloxane composition which comprises 0.1 to 50 ppm platinum-based metal based on the total amount of the solid content of the curing-reactive organopolysiloxane composition, wherein an adhesive force of a polymethyl methacrylate sheet, with a thickness of 2 mm provided with a cured layer with a thickness of 50 μm obtained by curing the curing-reactive organopolysiloxane composition, as measured at a tensile speed of 300 mm/min using a 180° peel test method according to JIS Z 0237, is not lower than 0.02 N/25 mm;

• wherein the curing-reactive organopolysiloxane composition comprises the following components (A) to (C):
• (A) a straight-chain or branched-chain organopolysiloxane having a number of alkenyl groups greater than 1 on average in the molecule;
• (B) an organopolysiloxane resin, where at least a part of the component (B) is a resin which consists of R3SiO1/2 units and SiO4/2 units and optionally having a hydroxyl group or a hydrolyzable group, wherein R is a monovalent organic group and not less than 90 mol % of R is an alkyl group or a phenyl group;
• and
• (C) an organohydrogenpolysiloxane having at least two Si—H bonds in the molecule;
• wherein a molar ratio of silicon-bonded hydrogen atom (SiH) groups in the component (C) to alkenyl groups in the curing-reactive organopolysiloxane composition is in a range of from 0.1 to 100;
• wherein at least a part of the component (A) is (A1) an alkenyl group-containing organopolysiloxane having a viscosity of not less than 100,000 mPa-s at 25° C. or having a plasticity in a range of from 50 to 200 as measured in accordance with a method as prescribed in JIS K6249;
• wherein a content of a vinyl (CH2═CH) portion in the alkenyl group in the component (A1) is in a range of from 0.005 to 0.400 wt. %, and
• wherein a content of the component (B) is in a range of from 1 to 500 parts by mass with respect to a total of 100 parts by mass of the components (A) and (C) in the curing-reactive organopolysiloxane composition.