Hybrid resins for high voltage applications
AssigneesElantas North America, Inc., Elantas Europe S.R.L.
InventorsRonald Goetter, Nathan Hussey, Mattia Ferraris, Paola Gherardi, Nicola Cuminetti, Marco Viola, David Vines, Thomas James Murray
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Abstract
The present invention relates to a composition comprising an epoxy and ester based resin, a reactive diluent and an initiator for a radical polymerization. Furthermore, the invention relates to a process for providing such composition, to a process for applying the composition, to the use of the composition as coating material and to the materials coated with the polymerized composition.
Claims21
A composition comprising:
- A) a resin component comprising:
- i. one or more, the same or different, groups of formula
- wherein R is an organic group comprising from 2 to 40 carbon atoms;
- ii. one or more groups comprising two ester groups and one ethylenically unsaturated group;
- and
- iii. one or more terminal or pendant groups comprising one ester group and one ethylenically unsaturated group;
- B) at least one reactive diluent comprising at least one ethylenically unsaturated polymerizable group and having a boiling point at atmospheric pressure higher than 200° C.;
- and
- C) a peroxide as an initiator for radical polymerization;
- wherein the resin component A has an acid value of not more than 50 mgKOH/g, wherein the composition has a viscosity in the range of 50 to 450 cP at a temperature of 25° C.
A process of preparing a treated substrate comprising a metal, the process comprising:
- a. providing a composition comprising:
- A) a resin component comprising:
- i. one or more, the same or different, groups of formula
- wherein R is an organic group comprising from 2 to 40 carbon atoms;
- ii. one or more groups comprising two ester groups and one ethylenically unsaturated group;
- and
- iii. one or more terminal or pendant groups comprising one ester group and one ethylenically unsaturated group;
- B) at least one reactive diluent comprising at least one ethylenically unsaturated polymerizable group and having a boiling point at atmospheric pressure higher than 200° C.;
- and
- C) a peroxide as an initiator for radical polymerization;
- wherein the resin component has an acid value of not more than 50 mgKOH/g, wherein the composition has a viscosity in the range of 50 to 450 cP at a temperature of 25° C.;
- b. applying the composition to a substrate comprising a metal;
- and
- c. polymerizing the composition.
A process for preparing a composition, the process comprising:
- preparing a resin component A by:
- providing A1) an epoxy resin, A3) a compound having one carboxylic acid group and one ethylenically unsaturated group, and a catalyst in a reactor, optionally in the presence of one or more inhibitors of a radical polymerization, obtaining a mixture;
- reacting the mixture to obtain a first reaction product until the acid value of the first reaction product is less than 50 mgKOH/g;
- providing in the reactor A2) a compound comprising a) two carboxylic acid groups or a carboxylic acid anhydride group, and b) one ethylenically unsaturated group;
- further reacting the mixture to obtain a second reaction product until the acid value of the second reaction product is less than 50 mgKOH/g;
- and
- adding to the resin component A:
- at least one reactive diluent B comprising at least one ethylenically unsaturated polymerizable group and having a boiling point at atmospheric pressure higher than 200° C.;
- and
- a peroxide as an initiator C for radical polymerization, wherein the resulting composition has a viscosity in the range of 50 to 450 cP at a temperature of 25° C.
Dependencies are inferred from the claim text.