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US 12,728,623 B2Granted
Reformable epoxy resin for composites and methods thereof
AssigneeZephyros, Inc.
InventorsSylvain Gleyal, Craig Chmielewski, Brandon Madaus, Alejandro Gutierrez
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Abstract
The present invention contemplates a method for forming a composite structure including a plurality of rigid layers and one or more reformable epoxy resin layers. The resulting composite is molded to form a non-planar composite structure.
Claims19
A method comprising:
- (i) forming a substantially planar composite structure having at least two layers, and
- a reformable epoxy resin adhesive material between the at least two layers;
- (ii) optionally cutting the composite structure to a desired shape;
- (iii) heating the substantially planar composite structure in a mold to form a non-planar composite structure;
- wherein
- the reformable epoxy resin adhesive material falls below its glass transition temperature upon exposure to ambient temperature;
- after the reformable epoxy resin adhesive material falls below its glass transition temperature, it can be heated multiple times above its glass transition temperature for molding into a non-planar composite structure.
4 more elements
Dependencies are inferred from the claim text.