Forming three-dimensional (3D) electronic parts

A method for forming an electronic part, comprising:

• applying a build material to form a build material layer corresponding to a layer of the electronic part;
• performing a plurality of printing passes over a portion of the build material, comprising:
• selectively applying an electronic agent on the portion of the build material in more than one of the printing passes;
• and
• selectively applying a fusing agent on the portion of the build material in at least one of the printing passes;
• exposing the build material to radiation in a plurality of heating events interleaved with the printing passes,
• wherein the portion of the build material is selectively fused together by the fusing agent during a final heating event of the heating events;
• and
• controlling selective application of the electronic agent in the more than one of the printing passes, the at least one of the printing passes in which the selective application of the fusing agent occurs, and interleaving of the heating events in relation to the printing passes to control a mechanical property and an electronic property of the layer of the electronic part.