Polishing apparatus and polishing method

Abstract

The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one polishing head (10) arranged near a flat portion of the substrate (W), wherein the polishing head (10) has a fluid pressing structure (12) configured to press the polishing tape (3) with fluid against the flat portion of the substrate, and the fluid pressing structure (12) has a fluid supply port (13) arranged so as to face a back surface of the polishing tape (3).

Dependencies are inferred from the claim text.