US 12,727,807 B2 · Apparatuses, methods, and systems for reconfigurable three-dimensional mesostructures

Abstract

Methods, apparatuses, and systems for fabricating reconfigurable three-dimensional mesostructures and microelectronic systems are provided. An example method for fabricating an example three-dimensional mesostructure includes providing a folding host in an unfolded state, wherein the folding host defines a trench portion between a first bonding site portion and a second bonding site portion of the folding host; bonding a precursor to the first bonding site portion and the second bonding site portion so that the precursor is suspended across the trench portion of the folding host; shaping the precursor to the three-dimensional mesostructure by transforming the folding host from the unfolded state to a folded state; and disengaging the three-dimensional mesostructure from the folding host.

Claims20

Dependent claims

A method for fabricating a three-dimensional mesostructure comprising:

providing a folding host in an unfolded state, wherein the folding host defines a trench portion between a first bonding site portion and a second bonding site portion of the folding host;
bonding a precursor to the first bonding site portion and the second bonding site portion so that the precursor is suspended across the trench portion of the folding host;
shaping the precursor to the three-dimensional mesostructure by transforming the folding host from the unfolded state to a folded state;
and
disengaging the three-dimensional mesostructure from the folding host.

2 more elements

A method for fabricating a three-dimensional epicardial bioelectronic probe comprising:

forming an epicardial bioelectronic precursor, wherein the epicardial bioelectronic precursor comprises a first precursor end portion and a second precursor end portion, wherein at least one strain sensor is positioned between the first precursor end portion and the second precursor end portion;
bonding the epicardial bioelectronic precursor to a folding host in an unfolded state, wherein the folding host defines a trench portion between a first bonding site portion and a second bonding site portion of the folding host;
shaping the epicardial bioelectronic precursor to a three-dimensional epicardial bioelectronic precursor by transforming the folding host from the unfolded state to a folded state;
attaching the three-dimensional epicardial bioelectronic precursor to a distal end of a probe;
and
inserting the three-dimensional epicardial bioelectronic probe in a catheter.

3 more elements

Dependencies are inferred from the claim text.

Apparatuses, methods, and systems for reconfigurable three-dimensional mesostructures

Life of this patent

Apparatuses, methods, and systems for reconfigurable three-dimensional mesostructures

Life of this patent

Abstract

Claims20