Wafer matching design method, wafer bonding structure and chip bonding structure

A wafer bonding structure, comprising:

• a first wafer comprising at least one unit array, each unit array comprising at least two first dies;
• a second wafer comprising at least one second die, each second die covering at least one of the unit array(s), and each second die matched in terms of performance with at least one of the first dies in the unit array(s) that the second die covers,
• wherein the first wafer is provided thereon with first alignment marks and the second wafer is provided thereon with second alignment marks, the first alignment marks corresponding to the second alignment marks, and
• wherein the second wafer is bonded to the first wafer,
• wherein the first wafer comprises a plurality of identical first exposure units, each of the first exposure units comprising at least one of the unit array(s), and wherein the second wafer comprises a plurality of identical second exposure units, each of the second exposure units comprising at least one of the second die(s),
• wherein the first alignment marks include first overlay marks;
• the second alignment marks include second overlay marks, the first exposure units are sized differently from the second exposure units, wherein some of the second overlay marks in the plurality of second exposure units correspond to some of the first overlay marks in the plurality of first exposure unit periodically or at intervals.