Pixel structure for displays
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorYu-Hsing Chang
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Abstract
Various embodiments of the present disclosure are directed towards an integrated circuit (IC) chip comprising a display pixel in which a bottom electrode and a reflector are separate and border. A light emission device overlies the reflector, and a top electrode overlies the light emission device. A coupling structure extends from the bottom electrode, alongside the reflector, to an interface between the light emission device and the reflector to electrically couple the bottom electrode to the light emission device.
Claims20
An integrated circuit (IC) chip comprising a display pixel, wherein the display pixel comprises:
- a bottom electrode;
- a reflector bordering the bottom electrode;
- a light emission device overlying the reflector;
- and
- a coupling structure extending from the bottom electrode, alongside the reflector, to a bottommost surface of the light emission device, wherein the coupling structure has a top surface elevated relative to the bottommost surface of the light emission device and further has a first sidewall facing the light emission device and overlying both the reflector and the bottom electrode.
An integrated circuit (IC) chip comprising a display pixel, wherein the display pixel comprises:
- a bottom electrode;
- a reflector bordering the bottom electrode;
- a light emission device overlying and directly contacting the reflector at an interface;
- and
- a coupling structure extending from the bottom electrode, alongside the reflector, to the interface to electrically couple the bottom electrode to the light emission device;
- wherein a top surface of the coupling structure overlies the reflector.
A method for forming an integrated circuit (IC) chip, the method comprising:
- forming a bottom electrode over and electrically coupled to an interconnect structure;
- depositing a dielectric layer over the bottom electrode;
- forming a reflector inset into the dielectric layer, comprising:
- patterning the dielectric layer to form a reflector opening;
- depositing a conductive layer filling the reflector opening;
- and
- performing a planarization into the conductive layer, wherein the planarization stops at the dielectric layer;
- patterning the dielectric layer to form a via opening exposing the bottom electrode;
- forming a coupling structure in the via opening;
- and
- forming a light emission device overlying the coupling structure and the reflector;
- wherein a native oxide layer forms atop the conductive layer during the planarization and persists to after the forming of the light emission device.
Dependencies are inferred from the claim text.