Semiconductor structure and method for manufacturing the same
AssigneeUnited Microelectronics Corp.
InventorsTien-Tsai Hung, Yi Liu, Guo-Hai Zhang, Ching-Hwa Tey
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AssigneeUnited Microelectronics Corp.
InventorsTien-Tsai Hung, Yi Liu, Guo-Hai Zhang, Ching-Hwa Tey
Estimating the term…
A semiconductor structure is provided. The semiconductor structure includes a wafer structure. The wafer structure has a normal region and a trimmed region adjacent to the normal region. A top surface of the trimmed region is lower than a top surface of the normal region. The semiconductor structure includes a dielectric layer and a conductive layer disposed on the wafer structure in the normal region and the trimmed region. The semiconductor structure includes a protective layer disposed on a portion of the dielectric layer in the trimmed region and a portion of the conductive layer in the trimmed region. The semiconductor structure includes another dielectric layer disposed on a portion of the dielectric layer in the normal region and a portion of the conductive layer in the normal region and on the protective layer.
A method for manufacturing a semiconductor structure, comprising:
Dependencies are inferred from the claim text.