Efficient clocking scheme for die-to-die connectivity
AssigneeEliyan Corporation
InventorsRamin Farjadrad, Nhan Nguyen
Life of this patent
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AssigneeEliyan Corporation
InventorsRamin Farjadrad, Nhan Nguyen
Estimating the term…
An integrated circuit (IC) chip includes a first data receiver including first receiver circuitry to receive first data from a second IC chip. A second data receiver includes second receiver circuitry to receive second data from the second IC chip. Timing circuitry couples to the first receiver and the second receiver in a shared configuration. The timing circuitry generates a receive timing signal to time reception of the first data and the second data by the first and second receivers. The timing circuitry generates the receive timing signal through use of a phase adjustment circuit. The first and second receivers sample the first and second data in response to the receive timing signal. The timing circuitry includes a forwarded timing interface for transferring a forwarded timing signal between the IC chip and the second IC chip.
An integrated circuit (IC) chiplet, comprising:
A chiplet-based system-in-package (SiP), comprising:
A method of operation in an integrated circuit (IC) chiplet, comprising:
Dependencies are inferred from the claim text.