Compliant pressure lid for processor socket hardware
AssigneeAmphenol Corporation
InventorsPaul R. Taylor, Rodney Grove
Life of this patent
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AssigneeAmphenol Corporation
InventorsPaul R. Taylor, Rodney Grove
Estimating the term…
Compliant lids for processor socket assemblies are described. The compliant lids described herein ensure uniform compression across the contact field notwithstanding the recent trend to continue to increase the physical dimension of the socket and the density of contacts. Compression uniformity can be enhanced by relocating the pressure exerted on the package away from the corners of the package. This can be accomplished by designing the compliant lids to have openings shaped to interrupt the continuous material that would otherwise extend from the corner of the lid to the region where the lid engages the processor. This void of material is shaped so that continual presence of material exists primarily in the region where the force delivery is preferred. Use of such compliant lids can enhance compression uniformity without having to rely on complex curved plates and stepped insulators.
A processor socket assembly, comprising:
A processor socket assembly, comprising:
A method for engaging a processor to a socket using a compliant lid comprising top and bottom surfaces, first, second, third and fourth corners, and first, second, third and fourth segments surrounding a central opening, the first segment joining the first corner to the second corner, the second segment joining the second corner to the third corner, the third segment joining the third corner to the fourth corner and the fourth segment joining the fourth corner to the first corner, the method comprising:
Dependencies are inferred from the claim text.