Electronic device including connector

An electronic device comprising:

• a housing;
• a main printed circuit board disposed in the housing;
• and
• a connector disposed in the housing and electrically connected with the main printed circuit board,
• wherein the connector comprises:
• a case forming an outer surface of the connector and having an opening formed in at least a portion of the outer surface;
• and
• a printed circuit board disposed in the case and comprising:
• a first layer where a plurality of first pins are disposed;
• a second layer where a plurality of second pins are disposed;
• and
• a ground layer disposed between the first layer and the second layer and disposed to maintain a substantially constant distance from the first layer and the second layer,
• wherein:
• the plurality of first pins comprise
• two first ground pins respectively disposed at two outermost positions;
• two first power pins disposed between the two first ground pins;
• and,
• two first super speed transmission pins respectively disposed between one of the two first ground pins and one of the two first power pins near to each other,
• wherein the plurality of second pins comprise;
• two second ground pins respectively disposed at two outermost positions;
• two second power pins disposed between the two second ground pins;
• two second super speed transmission pins respectively disposed between one of the two second ground pins and one of the two second power pins near to each other,
• wherein the ground layer comprises a mesh ground in which at least some ground electrodes of the ground layer are disposed in a mesh form.

A printed circuit board (PCB) of an electronic device connector, the PCB comprising:

• a first layer with first pins arranged at regular intervals and comprising two first ground pins at outermost positions, two first power pins, first signal pins, and a first super speed transmission (TX) pin;
• a second layer with second pins arranged at regular intervals in alignment with the first pins and comprising two second ground pins connected to the two first ground pins through first via, two second power pins connected to the two first power pins through second vias second signal pins and a second super speed TX pin;
• and
• a ground layer to maintain distance between the first and second layers and through which the first and second vias extend.