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US 12,725,921 B2Granted
Electronic device
AssigneeInnolux Corporation
InventorsTsung-Han Tsai, Liang-Yun Chiu
Life of this patent
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Abstract
An electronic device includes a substrate, plurality of electrodes disposed on the substrate, a plurality of metal elements disposed on the substrate, a plurality of first lines disposed on the substrate, and a radio frequency signal processor. One of the plurality of metal elements is overlapped one of the plurality of electrodes. The radio frequency signal processor provides a signal to the one of the plurality of electrodes through one of the plurality of first lines.
Claims7
An electronic device, comprising:
- a chip;
- a first insulating layer, surrounding to the chip and comprising a first portion and a hole;
- a metal layer, overlapped the first insulating layer;
- a first conductive structure, disposed in the hole;
- and
- a second insulating layer, surrounding to the chip, comprising a second portion, wherein at least part of the second insulating layer is surrounded by the first insulating layer;
- wherein the chip is electrically connected to the metal layer through the first conductive structure;
- wherein in a cross-sectional view:
- the first portion is disposed between the second portion and the first conductive structure;
- the second portion is interposed between the first portion and the chip;
- and
- a virtual extension line is defined by a bottom surface of the chip, the first portion has a first width corresponding to the virtual extension line, the second portion has a second width corresponding to the virtual extension line, and the first width is greater than the second width.
9 more elements
Dependencies are inferred from the claim text.