Waveguide converter
AssigneeAsahi Kasei Microdevices Corporation
InventorYohsuke Takeda
Life of this patent
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Abstract
A plurality of pairs of ground vias which are arranged, in a planar view, facing each other on opposite sides of the slit may include, in a direction that the slit extends in a planar view from a center of the second opening, at least one pair of first ground vias, which are positioned within a first distance range, and at least one pair of second ground vias, which are positioned within a second distance range. A minimum distance between via-walls of the at least one pair of first ground vias may be wider than a minimum distance between via-walls of the at least one pair of second ground vias. A signal at a first frequency band may be transmitted through the transmission line at a first resonating mode, and a signal at a second frequency band may be transmitted through the transmission line at a second resonating mode.
Claims14
A waveguide converter comprising:
- a substrate;
- and
- a waveguide which is arranged on a first surface side of the substrate and includes a cavity portion which extends in a first direction intersecting with the first surface,
- wherein the substrate includes:
- a dielectric layer;
- a first ground conductor layer which is arranged on the waveguide side of the dielectric layer, and which includes a second opening which faces a first opening which is one end of the cavity portion of the waveguide, and a slit which extends in a third direction intersecting with a second direction which is a longitudinal direction of the second opening;
- a transmission line which is arranged in the slit and extends along the first surface and the slit without contacting the first ground conductor layer;
- a conductor patch which is arranged in the second opening without contacting the first ground conductor layer;
- a connection line which is arranged in the second opening and the slit along the first surface and connects the transmission line to the conductor patch;
- a second ground conductor layer which is arranged on a side of the dielectric layer opposite to the first ground conductor layer;
- and
- a plurality of ground vias which are arranged, in a planar view, along an edge of each of the second opening and the slit, and electrically connect the first ground conductor layer to the second ground conductor layer, and
- the plurality of ground vias include a plurality of pairs of ground vias which are arranged, in a planar view, facing each other on opposite sides of the slit, and
- the plurality of pairs of ground vias include, in a direction that the slit extends in a planar view from a center of the second opening, at least one pair of first ground vias, which are positioned within a first distance range, and at least one pair of second ground vias, which are positioned within a second distance range which is further away from the center of the second opening than the first distance range, and
- a minimum distance between via-walls of the at least one pair of first ground vias is wider than a minimum distance between via-walls of the at least one pair of second ground vias, and
- a signal at a first frequency band is transmitted through the transmission line at a first resonating mode, and a signal at a second frequency band, which is different from the first frequency band, is transmitted through the transmission line at a second resonating mode, which is different from the first resonating mode.
Dependencies are inferred from the claim text.