System of providing power to chip on mainboard

A system of providing power to a chip on a mainboard, comprising:

• a first power module, located on the mainboard, wherein the first power module is configured to receive a first voltage and to provide a second voltage;
• a second power module and a third power module, wherein the second power module and the third power module are located on the mainboard and disposed at different sides of the chip, each of the second power module and the third power module is electrically connected to the first power module to receive the second voltage, the second power module provides a third voltage to the chip, the third power module provides a fourth voltage to the chip;
• and
• at least one power module controller, located on the mainboard, and configured to control operation of the second power module and the third power module.

A system of providing power to a chip on a mainboard, comprising:

• a first power module and a second power module, wherein the first power module and the second power module are located on the mainboard, each of the first power module and the second power module is configured to receive a first voltage, the first power module provides a second voltage, and the second power module provides a third voltage;
• a third power module and a fourth power module, wherein the third power module and the fourth power module are located on the mainboard, the third power module is electrically connected to the first power module to receive the second voltage, the fourth power module is electrically connected to the second power module to receive the third voltage, the third power module and the first power module are disposed at a first side of the chip, the fourth power module and the second power module are disposed at a second side of the chip, the third power module provides a fourth voltage to the chip, the fourth power module provides a fifth voltage to the chip;
• and
• at least one power module controller, located on the mainboard, and configured to control operation of the third power module and the fourth power module.

A system of providing power to a chip on a mainboard, comprising:

• a first power module, wherein the first power module is configured to receive a first voltage and to provide a second voltage;
• and
• a second power module and a third power module, wherein each of the second power module and the third power module is electrically connected to the first power module to receive the second voltage, the second power module provides a third voltage to the chip, and the third power module provides a fourth voltage to the chip,
• wherein the first power module and the second power module are located on a first surface of the mainboard, the third power module is located on a second surface of the mainboard, and the first surface and the second surface are opposite to each other.

A system of providing power to a chip on a mainboard, comprising:

• a first power module and a second power module, wherein each of the first power module and the second power module is configured to receive a first voltage, the first power module provides a second voltage, and the second power module provides a third voltage;
• and
• a third power module and a fourth power module, wherein the third power module is electrically connected to the first power module to receive the second voltage, the fourth power module is electrically connected to the second power module to receive the third voltage, the third power module provides a fourth voltage to the chip, the fourth power module provides a fifth voltage to the chip;
• wherein the first power module and the second power module are located on a first surface of the mainboard, the third power module and the fourth power module are located on a second surface of the mainboard, and the first surface and the second surface are opposite to each other.