Substrate and method for cutting the same, and electronic device

A substrate, comprising:

• at least two edges;
• and
• at least one end portion, each end portion being connected to two adjacent edges, wherein
• the end portion includes a cutting section and two breaking sections;
• an end of the cutting section is connected to one of the two adjacent edges through a breaking section, and another end of the cutting section is connected to another one of the two adjacent edges through another breaking section;
• and
• an orthographic projection of the cutting section on a plane where the substrate is located includes:
• a first circular arc, an arc center of the first circular arc being located at an inside of the substrate;
• and
• at least one of a second circular arc and a third circular arc, wherein
• a first end of the second circular arc is connected to an orthographic projection of a breaking section of the two breaking sections on the plane where the substrate is located, and a second end of the second circular arc is directly or indirectly connected to a first end of the first circular arc;
• an arc center of the second circular arc is located at an outside of the substrate;
• and
• a first end of the third circular arc is connected to an orthographic projection of another breaking section of the two breaking sections on the plane where the substrate is located, and a second end of the third circular arc is directly or indirectly connected to a second end of the first circular arc;
• an arc center of the third circular arc is located at an outside of the substrate, wherein
• the first circular arc, the second circular arc and the third circular arc are located in an orthographic projection of a same end portion on the plane where the substrate is located.