Chip-to-chip optical data communication system

An optical data communication system, comprising:

• a package substrate;
• a plurality of optical input/output (I/O) chiplets bonded to the package substrate, each of the plurality of optical I/O chiplets having at least one supply optical port, at least one transmit optical port, and at least one receive optical port located on a same side of said each of the plurality of optical I/O chiplets, wherein said same side of said each of the plurality of optical I/O chiplets is positioned next to a same side of the package substrate, wherein a given I/O chiplet of the plurality of optical I/O chiplets includes a transmit macro having an optical waveguide that extends from a corresponding one of the at least one supply optical port of the given I/O chiplet to a corresponding one of the at least one transmit optical port of the given I/O chiplet, the transmit macro also having at least one microring resonator modulator disposed within an evanescent optical coupling distance of the optical waveguide, wherein each of the plurality of optical I/O chiplets is configured in a same manner, wherein the package substrate includes electrical traces configured to provide electrical connection with each of the plurality of optical I/O chiplets;
• and
• a system-on-chip bonded to the package substrate, the system-on-chip electrically connected to the electrical traces within the package substrate, wherein the system-on-chip is positioned on a same side of each of the plurality of optical I/O chiplets,
• wherein each of the plurality of optical I/O chiplets includes an electrical I/O interface electrically connected to a portion of the electrical traces within the package substrate that are configured to provide for conveyance of electrical data signals between the system-on-chip and each of the plurality of optical I/O chiplets.