Fabrication of binary-phase photon sieve

A method of fabricating a large diameter photon sieve, the method comprising:

• depositing a layer of a material on a substrate, the layer having a thickness not to exceed 0.5 microns and an optical energy transmittance of at least 30% in the extreme ultraviolet (EUV) wavelength spectrum ranging from 10-120 nanometers, wherein a first face of the layer is exposed and a second face of the layer is adhered to the substrate;
• etching a set of holes through the layer of the material;
• adhering a layered etch-resistant cap to the layer of the material with the set of holes, wherein a portion of the layered etch-resistant cap fills the holes;
• etching a portion of the substrate to expose a portion of the second face of the layer of the material with the set of holes, wherein a remainder of the substrate remains intact;
• and
• removing the layered etch-resistant cap wherein the layer of the material with the set of holes is supported by the remainder of the substrate and forming an ultra-thin large diameter perforated membrane, said membrane having a diameter of at least 10 millimeters, which is operable as a photon sieve.

A method of fabricating a large diameter photon sieve, the method comprising:

• depositing a layer of a material on a substrate comprising a wafer of silicon coated with silicon dioxide, the layer having a thickness not to exceed 0.5 microns and the material being selected from the group consisting of silicon, niobium, zirconium, and mixtures thereof, wherein a first face of the layer is exposed and a second face of the layer is adhered to the silicon dioxide;
• etching a set of holes through the layer of the material;
• attaching an etch-resistant cover to the layer of the material with the set of holes;
• etching a portion of the substrate to expose a portion of the second face of the layer of the material with the set of holes, wherein a remainder of the substrate remains intact;
• and
• removing the etch-resistant cover wherein the layer of the material with the set of holes is supported by the remainder of the substrate,
• whereby forming an ultra-thin large diameter perforated membrane said membrane having a diameter of at least 10 millimeters.