Clearance measuring apparatus
AssigneeSamsung SDI Co., Ltd.
InventorsHeetaek Lim, Yongseung Shin, Junhaeng Cho, Sungkyun Jung, Seungjun Lee, Joonkil Kim
Life of this patent
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Abstract
One or more embodiments of the present disclosure provides a clearance-measuring apparatus including an image sensor in a mold including a frame, a punch on the frame and configured to be moved in a vertical direction, and a die on the frame and spaced apart from the punch, the image sensor being configured to capture an image of a space between the punch and the die, and a controller configured to measure a clearance of the punch and the die based on the image.
Claims18
A clearance-measuring apparatus comprising:
- an image sensor directed at a mold comprising a frame, a punch on the frame and configured to be moved in a vertical direction, and a die on the frame and spaced apart from the punch, the image sensor being configured to capture an image of a space between the punch and the die;
- a controller configured to measure a clearance of the punch and the die based on the image;
- and
- a light source on the frame and under the die and the punch, and configured to irradiate light between the die and the punch.
A clearance-measuring apparatus comprising:
- a base plate having thereon a mold comprising a frame, a punch on the frame and configured to be moved in a vertical direction, and a die on the frame and spaced apart from the punch;
- a first driver connecting the base plate and the mold, and configured to move the mold in multiple directions with respect to the base plate;
- a support on the base plate, and spaced apart from the mold;
- an image sensor coupled to the support, and configured to capture an image of a space adjacent to the die as the punch lowers;
- a second driver connecting the image sensor and the support, and configured to move the image sensor in multiple directions with respect to the support;
- and
- a controller configured to measure a clearance of the punch and the die based on the image.
Dependencies are inferred from the claim text.