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US 12,722,401 B2Granted
Thermal print head with COF structure
AssigneePrinics Co., Ltd.
InventorKwang-Ho Noh
Life of this patent
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Abstract
The thermal print head having COF structure is disclosed. According to the present invention, productivity can be improved with a low step of a protective resin by using a COF method, the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate by electrically connecting the ceramic substrate and the COF through thermal compression using ACF, and the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate.
Claims8
A thermal print head (TPH) with a COF structure, the TPH comprising:
- a TPH driving IC;
- a chip on film (COF) module including a film on which a conductive pattern is formed electrically connected to the TPH driving IC;
- a ceramic substrate electrically connected to the COF module;
- a heating resistor array having a plurality of heating elements formed on the ceramic substrate;
- a heat sink attached to a lower portion of the ceramic substrate to radiate heat, and
- a printed circuit board formed on an upper surface of the heat sink and electrically connected to the other side of the COF module,
- wherein the COF module is accommodated on or over an upper surface of the heat sink,
- wherein the ceramic substrate receives electric signals and a power from the COF module,
- wherein the ceramic substrate and the COF module are bonded using Anisotropic Conductive Film (ACF).
6 more elements
Dependencies are inferred from the claim text.