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US 12,721,601 B2Granted
Ultrasound phased array on flexible CMOS and methods for fabricating hereof
AssigneeThe Trustees of Columbia University in the City of New York
InventorsKenneth L. Shepard, Tiago Costa, Kevin Tien, Chen Shi
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Abstract
An ultrasound phased array integrated in flexible CMOS technology is provided. The CMOS IC chip is fabricated through various chip-thinning techniques, resulting in mechanical flexibility, robustness, and minimized mechanical loading for the piezoelectric transducers. The ultrasound phased array CMOS patch can allow for the generation of high intensity focal regions for maximum penetration in regions of interest.
Claims8
A method for fabricating a non-invasive, wearable device for neural monitoring and stimulation, comprising:
- thinning a complementary-oxide-semiconductor (CMOS) integrated circuit to a pre-determined thickness thereby causing the CMOS integrated circuit to become flexible;
- integrating a plurality of ultrasound transducers onto the CMOS integrated circuit, wherein each of the plurality of the ultrasound transducers includes a top side and a bottom side;
- and
- depositing a metal layer on the top side and the bottom side of each of the plurality of ultrasound transducers to form electrodes that are electrically coupled to the CMOS integrated circuit.
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Dependencies are inferred from the claim text.