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US 12,721,102 B2Granted
Cryogenic electrostatic chuck system and method for controlling same
AssigneeKwangwoon University Industry-Academic Collaboration Foundation
InventorsGi Chung Kwon, Hee Tae Kwon, Ji Hwan Kim, Woo Jae Kim, In Young Bang
Life of this patent
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Abstract
A cryogenic electrostatic chuck system and a method for controlling the same according to a preferred embodiment of the present invention is capable of performing a cryogenic process for a substrate, such as a cryogenic etching process and a cryogenic deposition process, even in a cryogenic range, and is capable of implementing a vertical etch profile, which is ideal for feature etching, with a high aspect ratio.
Claims11
A cryogenic electrostatic chuck device, comprising:
- a substrate holder which fixes a substrate by an electrostatic force;
- and
- a body which is disposed below the substrate holder and includes a thermal conductivity adjustment channel which is formed of a metal based material determined based on a coefficient of thermal expansion (CTE) of the substrate holder and adjusts a thermal conductivity based on a pressure formed by a thermal conductivity adjustment gas supplied by an adjustment gas supply unit,
- wherein the thermal conductivity adjustment channel includes a plurality of thermal conductivity adjustment sub channels and a thermal conductivity is adjusted for every thermal conductivity adjustment sub channel based on a pressure formed by the thermal conductivity adjustment gas supplied to the plurality of thermal conductivity adjustment sub channels by the adjustment gas supply unit.
1 more element
Dependencies are inferred from the claim text.