Image capture device and method of manufacturing such a device
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsFrançois Templier, Josep Segura Puchades, Fabrice Casset
Life of this patent
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Abstract
A device including: a transfer substrate including electric connection elements; and a plurality of elementary chips bonded and electrically connected to the transfer substrate, each elementary chip including at least one photodetector and an electronic circuit for reading from the at least one photodetector, the device further including, associated with at least one elementary chip, an emission, capture, or actuation element external to the elementary chip, bonded and electrically connected to the transfer substrate, each elementary chip including an electronic circuit for controlling the emission, capture, or actuation element associated with the chip.
Claims11
Device comprising:
- a transfer substrate comprising electric connection elements;
- and
- a plurality of elementary chips bonded and electrically connected to the transfer substrate, each elementary chip comprising at least one photodetector and an electronic circuit for reading from said at least one photodetector, the elementary chips being arranged in an array of rows and columns defining a pixilated image capture device, each elementary chip corresponding to a pixel of the image capture device,
- the device further comprising, associated with at least one elementary chip of the plurality of elementary chips, an emission, capture, or actuation element external to the elementary chip, bonded and electrically connected to the transfer substrate, each elementary chip comprising an electronic circuit for controlling the emission, capture, or actuation element associated with the chip,
- wherein, in each column of the array, the elementary chips of the column are connected to at least one column conductive track common to the elementary chips of the column, and, in each row of the array, the elementary chips of the row are connected to at least one row conductive track common to the elementary chips of the row.
Dependencies are inferred from the claim text.