Image display device and method for manufacturing image display device

An image display device comprising:

• a light-transmitting member including a first surface;
• a light-emitting element including:
• a light-emitting surface on the first surface, and
• an upper surface at a side opposite to the light-emitting surface;
• a first insulating film covering the first surface and the light-emitting element;
• a circuit element located on the first insulating film;
• a second insulating film covering the first insulating film and the circuit element;
• a first via extending through the first and second insulating films;
• a second via extending through the first and second insulating films;
• a first wiring layer located on the second insulating film;
• a second wiring layer located on the first surface, the second wiring layer being light-transmissive;
• wherein:
• the first via is located between the first wiring layer and the upper surface and electrically connects the first wiring layer and the upper surface,
• the first wiring layer includes:
• a first wiring part, and
• a second wiring part separated from the first wiring part,
• the first via is located between the first wiring part and the upper surface and electrically connects the first wiring part and the upper surface, and
• the second via is located between the second wiring part and the second wiring layer and electrically connects the second wiring part and the second wiring layer.

An image display device comprising:

• a light-transmitting member including a first surface;
• a first semiconductor layer including a light-emitting surface on the first surface, wherein the light-emitting surface comprises a plurality of light-emitting regions;
• a plurality of light-emitting layers that are separated from each other on the first semiconductor layer;
• a plurality of second semiconductor layers located respectively on the plurality of light-emitting layers, the plurality of second semiconductor layers being of a different conductivity type from the first semiconductor layer;
• a first insulating film covering the first surface, the first semiconductor layer, the plurality of light-emitting layers, and the plurality of second semiconductor layers;
• a plurality of transistors that are separated from each other on the first insulating film;
• a second insulating film covering the first insulating film and the plurality of transistors;
• a plurality of first vias extending through the first and second insulating films;
• and
• a first wiring layer located on the second insulating film, wherein:
• the plurality of second semiconductor layers are separated from each other by the first insulating film, and the plurality of light-emitting layers are separated from each other by the first insulating film,
• the plurality of first vias are located respectively between the first wiring layer and the plurality of second semiconductor layers and electrically connect the first wiring layer and the plurality of second semiconductor layers, respectively.