Lead frame sheet and optoelectronic semiconductor device

An optoelectronic semiconductor device comprising:

• at least two metallic lead frame parts-;
• and
• a package body made of at least one plastic material and mechanically connecting the at least two lead frame parts,
• wherein each one of the lead frame parts comprises a bottom tie bar extending to a side face of the semiconductor device,
• wherein at the side face the bottom tie bars form part of a bottom face of the semiconductor device,
• wherein each one of the lead frame parts is for an electric component at a top side and for an external carrier at a bottom side opposite the top side, the bottom side being part of the bottom face, and
• wherein, towards the top side, the bottom tie bars narrow such that each bottom tie bar has a local minimum or a global minimum of a width at the top side and at the side face.

A lead frame sheet comprising:

• a plurality of device units, each device unit being configured for an optoelectronic semiconductor device and comprising at least two metallic lead frame parts configured for being applied to an electric component at a top side and configured for being soldered onto an external carrier at a bottom side opposite the top side,
• wherein each one of the lead frame parts comprises at least one bottom tie bar connecting adjacent ones of the device units,
• wherein, at a border line between adjacent ones of the device units, the bottom tie bars form part of the bottom side, and
• wherein, towards the top side, the bottom tie bars narrow such that each of the bottom tie bars has a global minimum of a width at the top side and along the border line, and
• wherein the bottom tie bars are of trapezoidal shape, seen in cross-section along the border line, the bottom tie bars are of trapezoidal shape.