Cooler for power module of inverter

A cooler for a power module of an inverter, comprising:

• power modules comprising chips arranged in a row direction and a column direction perpendicular to the row direction;
• a heat sink extending in a first direction parallel to the row direction, the power modules being coupled to one surface of the heat sink and a microfluidic channel comprising grooves disposed on another surface of the heat sink, the grooves extending in a longitudinal direction of the heat sink;
• and
• a housing comprising a first groove part comprising an inlet configured to receive a fluid and a first groove extending in a second direction that is substantially parallel to the first direction to communicate with the inlet, a second groove part comprising an outlet configured to discharge the fluid and a second groove extending in the second direction to communicate with the outlet, and a separation part formed between the first groove part and the second groove part,
• wherein the first direction is a direction defined along the heat sink and the second direction is a direction defined along the first groove and the second groove,
• wherein the heat sink is coupled to the housing to cause the first direction to be parallel to the second direction, the first groove is covered with the heat sink to form a first flow path, the second groove is covered with the heat sink to form a second flow path, and the microfluidic channel covers the separation part to cause the grooves to form a third flow path that fluidly connects the first flow path and the second flow path, and
• wherein at least one of the chips is disposed in a vertical direction perpendicular to the row direction and the column direction from the third flow path,
• wherein the longitudinal direction is parallel to the column direction, and
• wherein a cross-sectional area of the third flow path perpendicular to the longitudinal direction is less than a cross-sectional area of the first flow path perpendicular to the second direction.