Back to results
US 12,720,683 B2Granted
Display module, method of manufacturing the same, and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorHiroshi Nishikawa
Life of this patent
Estimating the term…
Abstract
Provided is a display module capable of reducing connection resistance between a mounting board and a display. A display module includes a mounting board provided with a bump, and a display mounted on the mounting board and provided with a connection terminal bonded to the bump by solid-phase diffusion bonding.
Claims12
A display module, comprising:
- a mounting board with a bump;
- and
- a display mounted on the mounting board, wherein
- the display is provided with a connection terminal bonded to the bump by solid-phase diffusion bonding,
- a surface of the bump contains gold, and
- a surface of the connection terminal includes at least one of aluminium or gold and further includes a gold plating that comprises gold/palladium/nickel.
3 more elements
Dependencies are inferred from the claim text.