Raised frame layer in bulk acoustic wave device

A packaged module comprising:

• a packaging substrate;
• an acoustic wave filter on the packaging substrate and configured to filter a radio frequency signal, the acoustic wave filter including a bulk acoustic wave (BAW) device, the BAW device having a first electrode, a second electrode, a piezoelectric layer positioned between the first electrode and the second electrode, and a raised frame structure outside of a middle area of an active domain of the BAW device, the raised frame structure comprising one or more raised frame layer(s), at least one of the one or more raised frame layer(s) comprising a tapered portion tapering in a direction towards the middle area of the active domain, the raised frame structure comprising a first raised frame layer and a second raised frame layer, the first raised frame layer being supported by the first electrode away from the piezoelectric layer, the first raised frame layer partially covering the first electrode and leaving at least the middle area of the active domain uncovered by the first raised frame layer;
• and
• a radio frequency component electrically coupled to the acoustic wave filter and positioned on the packaging substrate, the acoustic wave filter and the radio frequency component being enclosed within a common package.

A wireless mobile device comprising a packaged module, the packaged module comprising:

• a packaging substrate;
• an acoustic wave filter on the packaging substrate and configured to filter a radio frequency signal, the acoustic wave filter including a bulk acoustic wave (BAW) device, the BAW device having a first electrode, a second electrode, a piezoelectric layer positioned between the first electrode and the second electrode, and a raised frame structure outside of a middle area of an active domain of the BAW device, the raised frame structure comprising one or more raised frame layer(s), at least one of the one or more raised frame layer(s) comprising a tapered portion tapering in a direction towards the middle area of the active domain, the raised frame structure comprising a first raised frame layer and a second raised frame layer, the first raised frame layer being supported by the first electrode away from the piezoelectric layer, the first raised frame layer partially covering the first electrode and leaving at least the middle area of the active domain uncovered by the first raised frame layer;
• and
• a radio frequency component electrically coupled to the acoustic wave filter and positioned on the packaging substrate, the acoustic wave filter and the radio frequency component being enclosed within a common package.