Corrugated buried heterostructure laser and method for fabricating the same

A method for fabricating a corrugated buried heterostructure laser, the method comprising:

• coating a substrate with a dielectric layer, the substrate having a <0-11> direction;
• patterning the dielectric layer to obtain a hollow corrugated structure, the hollow corrugated structure comprising a central portion and regularly spaced-apart tabs laterally extending from the central portion, each regularly spaced-apart tab being aligned with the <0-11> direction of the substrate;
• etching, in situ, the hollow corrugated structure to form angles at corresponding edges thereof;
• diffusing, in situ, a p-dopant in the substrate to obtain a p-dopant distribution in a portion of the substrate, the p-dopant distribution having a distribution profile being provided by the angles formed at the corresponding edges of the hollow corrugated structure;
• etching, in situ, a portion of the p-doped substrate, thereby defining a tapered recess in the substrate;
• growing a n-blocking layer in the tapered recess;
• sequentially growing an active region over a portion of the n-blocking layer, a p-overclad over the active region, a p-contact over the p-overclad and a p-metal contact over the p-contact;
• and
• growing a n-metal contact on a backside of the substrate to obtain the corrugated buried heterostructure laser.