Streaming protocol flow control for die-to-die interfaces
AssigneeSamsung Electronics Co., Ltd.
InventorsSoon Ju Kim, Kah Kawe Chang
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorsSoon Ju Kim, Kah Kawe Chang
Estimating the term…
Provided are systems, methods, and apparatuses for streaming protocol flow control for die-to-die interfaces. In some examples, the systems, devices, and methods include allowing a first packet to be transmitted from a source to a destination based on a credit count; decrementing the credit count based on transmitting a flit of the first packet to the destination; and incrementing the credit count based on receiving a first return credit from the destination. In some examples, the systems, devices, and methods include receiving, at a destination from a source, a first return credit in a header flit of a first packet; incrementing a credit count based on receiving the first return credit from the source; allowing a second packet to be transmitted to the source based on the credit count; and decrementing the credit count based on transmitting a flit of the second packet to the source.
A method of die-to-die (D2D) credit-based flow control, the method comprising:
A method of die-to-die (D2D) credit-based flow control, the method comprising:
A non-transitory computer-readable medium storing code that comprises instructions executable by a processor of a die-to-die (D2D) credit-based flow control device to:
Dependencies are inferred from the claim text.