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US 12,717,233 B2Granted
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
AssigneeResonac Corporation
InventorsTetsuya Kato, Akiko Takeda, Yutaka Kawakami
Life of this patent
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Abstract
An aspect of the present disclosure relates to a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, in which the binder polymer includes a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group, and a weight molecular weight of the binder polymer is 7500 to 23000.
Claims14
A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, and a photopolymerization initiator,
- wherein the binder polymer includes a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group and a structural unit derived from styrene or a styrene derivative, and a weight average molecular weight of the binder polymer is 9000 to 21000,
- wherein a content of the structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group is 1 to 10% by mass on the basis of the total mass of structural units derived from polymerizable monomers constituting the binder polymer, and
- wherein a content of the structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group and the structural unit derived from styrene or a styrene derivative is 50% by mass or more on the basis of the total mass of structural units derived from polymerizable monomers constituting the binder polymer.
Dependencies are inferred from the claim text.