Snout assembly
AssigneeLumentum Operations LLC
InventorsYusheng Chen, Jack Xu, Nicolas Malonzo, Jihua Du, Prasad Yalamanchili, Jaspreet Singh
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Abstract
A snout assembly of a laser pump module may include a snout bulkhead comprising an opening along a longitudinal axis of the snout bulkhead. The snout assembly may include a ferrule in the opening of the snout bulkhead. The snout assembly may include a metallization layer on a portion of an outer surface of the ferrule. The snout assembly may include a copper-silver (CuAg) solder material between the metallization layer and a surface of the opening. The CuAg solder material may bond the ferrule and the snout bulkhead.
Claims20
A snout assembly of a laser pump module, comprising:
- a snout bulkhead comprising an opening along a longitudinal axis of the snout bulkhead;
- a ferrule in the opening of the snout bulkhead;
- a metallization layer on a portion of an outer surface of the ferrule;
- and
- a copper-silver (CuAg) solder material between the metallization layer and a surface of the opening,
- wherein the CuAg solder material bonds the ferrule and the snout bulkhead.
A snout assembly, comprising:
- a snout bulkhead comprising an opening along a longitudinal axis of the snout bulkhead,
- wherein the opening in the snout bulkhead comprises a first region and a second region;
- a ferrule in the opening of the snout bulkhead,
- wherein the ferrule spans a portion of the first region and a portion of the second region;
- a metallization layer on a portion of an outer surface of the ferrule;
- and
- a copper-silver (CuAg) solder material between the metallization layer and a surface of the opening,
- wherein the CuAg solder material provides a hermetic seal between the snout bulkhead and the ferrule.
A snout assembly of a laser pump module, comprising:
- a snout bulkhead comprising an opening;
- a ferrule in the opening of the snout bulkhead;
- a metallization layer on an outer surface of the ferrule;
- and
- a copper-silver (CuAg) solder material that bonds the ferrule and the snout bulkhead,
- wherein a coefficient of thermal expansion (CTE) of the metallization layer transitions from a lower CTE nearer to the ferrule to a higher CTE nearer to the CuAg solder material.
Dependencies are inferred from the claim text.